bridge Rectifier GBPC3510

The GBPC3510 adopts a brand new aluminum bottom plastic shell packaging, which is very different from the metal zinc shell used in KBPC3510, and has better heat dissipation and stability performance. Customers who have used metal zinc shell packaging will have this feeling

Contact and heat dissipation are relatively not outstanding, and the large amount of thermal energy accumulated during long-term operation of internal chips cannot be effectively exported, which directly affects the reliability of the bridge stack. The GBPC3510 adopts a brand new aluminum bottom plastic shell packaging, which has the best conductivity efficiency and can quickly conduct heat, greatly improving the reliability of the power supply.

GBPC3510 adopts aluminum bottom plastic shell to protect chip safety

We know that GBPC3510 belongs to the category of semiconductor power devices, and when it works, the chip will generate heat. Because the chip is wrapped in epoxy resin, when the chip heats up, the resin will expand slightly, and when the rectifier bridge stops working, the resin will shrink slightly.

Because the thermal equilibrium points of metal zinc and epoxy resin are not consistent, if the resin and shell are not synchronized during thermal expansion and contraction, it will cause hard strain on the chip. Although this hard force change is not significant for the entire rectifier bridge, it is not significant for the built-in chip